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Perhaps a word about feature size, chip size and
yield would be in order. We saw earlier that circuits arerepeated many times across a wafer's surface during the
photolithographic stage. Although great care is exercised intrying to prevent defects from becoming part of a wafer surface
(clean rooms, "bunny" suits, ultra-pure chemicals etc.) eachwafer that goes through a fab will end up with
some "killer" defects distributed across
the wafer surface
.
Imagine that we try to manufacture some chips of a certain
size. A glance at
shows that we would have
15 of 21 good chips, for a yield of about 71%. Suppose we could,through improved technology, perform a 30% "shrink" on the
circuit -
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