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Figure (1.55) in SSPD_Chapter 1_Part 11_Soild state of Matter_Crystalline Nature of Solid depicts the three cubic crystal systems: simple, bcc and fcc.
Silicon and Germanium are Diamond lattice structures. Diamond structure has been described in SSPD_Chapter 1_Part 11_Soild state of Matter_Crystalline Nature of Solid in Figure 56.
These dangling bonds are responsible for the surface states which if not properly controlled and passivated will lead to serious flicker noise problem as well as to the failure of the devices. At the initial stages of MOS fabrication there was serious Na impurity problem coupled with surface states problem which was leading to very low yields. Andy Grove, who was the cofounder of INTEL along with Gordon Moore and Robert Noyce , came into grip of this problem and gave a permanent solution of the low yields which enabled MOS Technology to take off. MOS Technology is the key to the fabrication of microprocessors.
GaAs has zincblende lattice which is identical to diamond lattice except that one fcc sublattice consists of Ga and the other fcc sublattice consists of As. So in Plan View we see Ga atom surounded by four As atoms and similarly As atom is surrounded by four Ga atoms thereby each atom is fulfilling the octave condition by time sharing the electrons from the 4 neighboring atoms. The plan view of GaAs tetrahedral structure is shown in Figure(1.61).
Figure 1.61. Zincblende structure of GaAs.
1.11.7. CRYSTAL ORIENTATION.
Crystals are anisotropic because of different pattern of arrangement of atoms in different directions. Hence etching rate of the crystal is different in different directions. This property is utilized in Integrated Circuit Technology. Therefore crystal orientation is important in device fabrication and hence needs to be clearly defined.
The basis in which we define the planes and directions of a crystalline lattice is made possible by Miller Indices. This is derived from the Cartesian Coordinates in the following manner:
The normal to the plane along which the crystals cleave is the crystal cleavage plane.. Generally they cleave along<1,1,1>plane. The cleavage plane is the plane of highest atomic density. If the surface of the Si wafer, known as major flat, is parallel to<111>plane then the crystal orientation is<111>. Different planes of a crystal structure is shown in Figure (1.62).
If the surface of the wafer is parallel to YZ plane then the crystal orientation is<100>. For MOS fabrication crystals with orientation<100>is utilized. For other applications<111>crystal orientations are preferred.
Figure. 1.62. Different Planes of a crystal.
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