Summary:
Perform functions to research, develop, document, qualify, and implement production processes for standard and custom packaged semiconductor products. Establish stable manufacturing processes at the prototype phase and release to production. Review, develop, and update statistical process control methods and related documentation, working within the limits of established policies.
Essential Duties & Responsibilities:
Lead process technology transfers from Process Engineering department to Manufacturing department;
Develop robust production processes using Design of Experiments (DOEs);
Establish validation and verification criteria for new processes & products;
Create and revise documentation detailing production processes;
Take the lead to provide engineering support to facilitate production processes and troubleshoot problems in assembly areas;
Stay abreast of best practices and technologies and provide input on new processes to enhance or expand capabilities;
Interface with Design Engineering team regarding process capabilities, materials, and review new products to ensure they meet Design for Manufacturing (DFM) criteria;
Identify, facilitate, and prioritize opportunities for process improvements;
Other Duties & Responsibilities:
Perform or assist with any operations, as required to maintain workflow and to meet schedules and quality requirements.
Maintain safe work area and comply with safety procedures and equipment operating rules keeping work area in a clean and orderly condition.
Follow clean room and other environmental precautions and procedures as required.
Participate in any variety of meetings and work groups to integrate cross functional activities, communicate issues, obtain approvals, resolve problems, and maintain specified level of knowledge pertaining to new developments, requirements, and policies.
Maintain a safe work area and comply with safety policies and procedures and equipment operating rules; keeping work area in a clean and orderly condition.
Comply with all quality and ITAR policies, practices and procedures.
Participate in proactive team efforts to achieve departmental and company goals.
Contribute to building a positive team spirit.
Communicate effectively with all levels of employees.
Protect confidential information by not communicating, disclosing to, or using for benefit of 3rd parties.
Maintain the highest degree of honesty and integrity at all times.
Perform other related duties as assigned.
Requirements
Job Qualifications:
BSME or equivalent 4 year technical degree or 4-6 years of combined education and experience
3 years of related manufacturing experience
CAD, Solid works software courses, and/or experience
PADS, CAM350 software knowledge is a plus.
Job Skills:
Fast technical document generation/modification CAD, Excel, (PCB software is a plus).
Design tool/fixtures with minimal guidance.
Knowledge of Mil-PRF-38535 / Mil-PRF-38534 in military standards a plus.
Knowledge of Mil-STD-883 / Mil-STD-750 in test methods with related equipment (wire bond, die attach, & furnace) a plus.
Knowledge or experience with Automatic assembly equipment for Wire bond, Die attach a plus
Knowledge in semiconductor manufacturing a plus.
Self-motivated with the ability to align priorities in accordance with business goals and meet deadlines in a fast-paced environment.
Team player who enjoys working with different disciplines.
SMT Process development in both leaded and lead free assemblies.
Tools & Equipment:
Computer and peripherals
Standard office equipment
Manuals and automatic semiconductor assembly equipment
Measuring devices, and required clean room clothing
Benefits
Medical, Dental, and Vision
401k
Company Paid Basic Life Insurance, STD, and LTD
Vacation Time
Sick Time
Holidays
Tuition Reimbursement
Pet Insurance
Legal Insurance offered through Allstate
Critical Illness, Hospitalization and Accident Insurance offered through Allstate
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