Microelectronics Engineer - Experienced Level Maryland

As an Engineering and Physical Science professional, you will use your skills to create the systems and tools that will be used to enhance the operation of intelligence.
You will advise, administer and perform scientific projects, such as planning, designing, and constructing specialized equipment, and ensuring adherence to sound engineering and scientific standards and principles.
The NSA offers multiple areas of focus for facilities engineers, including computer, architectural, electrical, mechanical, and structural.
In addition, we are seeking skills that include computer design, microelectronics, radio frequency design, and systems engineering.
Apply your science and engineering skills to protect the nation.
When submitting your application, please ensure that you fully populate all sections of the resume tool with all relevant skills, experience, and education, as the resume entered into the tool will be the primary resume used to evaluate your application.
Please do NOT populate the resume tool with - see resume.
Please attach an unofficial copy of your transcripts from all schools attended when applying for this position.
Providing a copy of your transcripts is especially critical to ensure the position's coursework obligations have been met.
With the ever-increasing technological complexities in the world of Microelectronics, we need talented Microelectronics Engineers to be part of our team designing, assembling, testing, and qualifying the next generation of electronics hardware in support of our mission.
Our goal is to provide microelectronics services of the highest quality to ensure the success of the Agency's mission.
Microelectronics Engineers utilize electrical, computer, mechanical, and materials engineering knowledge and skills to design, assemble, test, analyze and qualify the next generation of electronics hardware in support of the NSA mission.
The National Security Agency (NSA) currently has opportunities for three types of Microelectronics positions:
Microelectronics Package Design Engineer, Microelectronics Process Engineer, and Microelectronics Technology Engineer.
1.
A Microelectronics Package Design Engineer is focused on developing advanced microelectronics systems through the design of custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures.
Areas of responsibility can also include:
• Knowledge of Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) design- Knowledge of Register Transfer Level (RTL) design including Verilog and VHDL- Knowledge of Digital/Analog Logic design/simulation, functional verification, Design For Test (DFT), testability analysis- Understanding and development of assembly specifications in accordance with industry standards- Understanding and application of Signal Integrity (SI)/Power Integrity (PI)/Electro-Magnetic Integrity (EMI) Analysis methodologies for design- Conduct research including studies, experiments, and investigations on new or alternate methodologies- Enhance process design and development to support advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics2.
A Microelectronics Process Engineer is focused on assembly and fabrication of advanced microelectronics systems such as custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures.
• Participate in assembly and fabrication process improvement efforts- Conduct research including studies, experiments, and investigations on new or alternate methodologies, fabrication, and/or assembly equipment- Enhance process and mature development of advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics3.
A Microelectronics Technology Engineer is focused on the test, failure, and physical analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies, and/or system enclosures.
• Conduct environmental and reliability tests- High-pin-count Integrated Circuit (IC) design and operation validation- Parametric testing - Accelerated testing / qualification / screening- Develop test plans according to industry and military specifications- Design and develop test platforms- Support quality assurance efforts for developed and fielded systems- Disassembly and sample preparation for physical analysis of ICs for failure analysis- Perform scanning electron microscopy (SEM), low energy electrons microscopy (LEEM), and/or atomic force microscopy (AFM)When submitting your application, please ensure that you fully populate all sections of the resume tool with all relevant skills, experience, and education, as the resume entered into the tool will be the primary resume used to evaluate your application.
The National Security Agency (NSA) is part of the DoD Intelligence Community Defense Civilian Intelligence Personnel System (DCIPS).
All positions in the NSA are in the Excepted Services under 10 United States Codes (USC) 1601 appointment authority.
DoD Components with DCIPS positions apply Veterans' Preference to eligible candidates as defined by Section 2108 of Title 5 USC, in accordance with the procedures provided in DoD Instruction 1400.
25, Volume 2005, DCIPS Employment and Placement.
If you are a veteran claiming veterans' preference, as defined by Section 2108 of Title 5 U.
S.
C.
, you may be asked to submit documents verifying your eligibility.
Apply soonest, as job postings can close earlier than stated end dates due to changes in requirements.
It is important to review and note the minimum qualificatio.