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A number of researchers have demonstrated the potential of a series of β-diketonate Cu(I) compounds, (β-diketonate)CuL n , where L is Lewis base and n = 1 or 2, that fulfill most of the criteria outlined for precursor design before. These species were chosen as copper precursors for the following reasons:
A general feature of the reactions of Cu(I) precursors is that they thermally disproportionate, a mechanism likely to be responsible for the high purity of the copper films observed since ligand decomposition does not occur. The disproportionation mechanism is shown in [link] for (β-diketonate)CuL. The unique capabilities of this class of compounds result from this reaction mechanism by which they deposit copper. This mechanism is based on the dissociative adsorption of the precursor to form Cu(hfac) and L, disproportionation to form Cu(hfac) 2 and Cu and desorption of Cu(hfac) 2 and L.
Thus, the starting material acts as its own reducing agent and no external reducing agent such as H 2 is required. Another advantage of the Cu(I) β-diketonates over the Cu(II) β-diketonates is that in the former the ligand L can be varied systematically, allowing the synthesis of a whole series of different but closely related compounds.
Selectivity deposition has been studied in both hot- and cold-wall CVD reactors as a function of the nature of the substrate, the temperature of the substrate and the nature of the copper substituents. Selectivity has usually been evaluated by using Si substrates on which SiO 2 has been grown and patterned with various metals by either electron-beam deposition, CVD or sputtering. Research has suggested that selectivity on metallic surfaces is attributable to the biomolecular disproportionation reaction involved in precursor decomposition.
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